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US Patent Issued to International Business Machines on Aug. 25 for "Hybrid memory on front and backside of a wafer" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,772, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Hybrid memory on front and backside of a waf... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,773, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ja... और पढ़ें


US Patent Issued to QUALCOMM on Aug. 25 for "Device having an in-substrate inductor and method for making the inductor" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,774, issued on Aug. 25, was assigned to QUALCOMM Inc. (San Diego). "Device having an in-substrate inductor and method for making the induct... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Packages with chips comprising inductor-vias and methods forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,775, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Packages with chips comprising indu... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Deep trench resistor structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,776, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Deep trench resistor structure ... और पढ़ें


US Patent Issued to International Business Machines on Aug. 25 for "Resistor structure in integrated circuit" (New York, Vermont Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,777, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistor structure in integrated circuit" wa... और पढ़ें


US Patent Issued to Intel on Aug. 25 for "Integrated circuits with high dielectric constant interfacial layering" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,778, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuits with high dielectric constant interfacial l... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Semiconductor structure and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,779, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of forming th... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Schottky barrier diode (SBD) leakage current blocking structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,780, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Schottky barrier diode (SBD) leakag... और पढ़ें


US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 25 for "Semiconductor device and related chip and preparation method" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,781, issued on Aug. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Semiconductor device and related chip and prepara... और पढ़ें